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Bağlantı Noktaları, Erkek Pinleri
| Fotoğraf | Üretici Parça # | Mevcutluk | Miktar | Veri Sayfası | Seri | Paketlenme | Ürün Durumu | Bağlantı Cihazı Türü | Kontak Türü | Adım - Eşleşen | Pozisyon Sayısı | Satır Sayısı | Satır Aralığı - Eşleşen | Yüklü Pozisyon Sayısı | Stil | Koruma Örtüsü | Montaj Türü | Sonlandırma | Sabitleme Türü | Kontak Uzunluğu - Eşleşen | Kontak Uzunluğu - Post | Toplam Kontak Uzunluğu | Yalıtım Yüksekliği | Kontak Şekli | Kontak Bitişi - Eşleşen | Kontak Bitişi Kalınlığı - Eşleşen | Kontak Bitişi - Post | Kontak Malzemesi | Yalıtım Malzemesi | Özellikler | Çalışma Sıcaklığı | Akım Derecesi (Amper) |
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HMTSW-206-12-T-T-100-LACONN HEADER VERT 18POS 5.08MM |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 18 | 3 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.319" (8.10mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 3A |
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HMTSW-209-07-G-Q-100-RACONN HEADER R/A 18POS 5.08MM |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 18 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.319" (8.10mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-209-09-S-D-200-LACONN HEADER VERT 18POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 18 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.200" (5.08mm) | - | - | 0.240" (6.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-209-28-S-D-100-RACONN HEADER R/A 18POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 18 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.240" (6.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-211-11-S-D-100-RACONN HEADER R/A 22POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.240" (6.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-212-12-S-T-100-LACONN HEADER VERT 36POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 36 | 3 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.319" (8.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-213-23-T-Q-255CONN HEADER VERT 26POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 26 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.255" (6.48mm) | 0.090" (2.29mm) | 0.445" (11.30mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 3A |
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HMTSW-216-10-S-Q-100-RACONN HEADER R/A 32POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 32 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.319" (8.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-220-11-T-Q-740CONN HEADER VERT 40POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 40 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.740" (18.80mm) | 0.090" (2.29mm) | 0.930" (23.62mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 3A |
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HMTSW-220-22-G-Q-100-LACONN HEADER VERT 40POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 40 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.319" (8.10mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-221-09-G-D-016CONN HEADER VERT 42POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 42 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.016" (0.41mm) | 0.614" (15.60mm) | 0.730" (18.54mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-224-09-L-Q-100-RACONN HEADER R/A 48POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 48 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.319" (8.10mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-224-12-S-Q-430-LACONN HEADER VERT 48POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 48 | 2 | 0.200" (5.08mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.430" (10.92mm) | - | - | 0.319" (8.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HMTSW-225-08-G-S-235CONN HEADER VERT 25POS 5.08MM |
0 |
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Veri Sayfası |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.235" (5.97mm) | 0.195" (4.95mm) | 0.530" (13.46mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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HTST-104-01-S-DV-PCONN HEADER SMD 8POS 2.54MM |
0 |
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Veri Sayfası |
Flex Stack, HTST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | 0.250" (6.35mm) | - | - | 0.350" (8.89mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot, Pick and Place | -55°C ~ 125°C | 3.4A per Contact |
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HTST-105-01-F-DV-10CONN HEADER SMD 10POS 2.54MM |
0 |
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Flex Stack, HTST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | 9 | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | 0.250" (6.35mm) | - | - | 0.350" (8.89mm) | Square | Gold | 3.00µin (0.076µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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HTST-105-01-L-DV-08CONN HEADER SMD 10POS 2.54MM |
0 |
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Flex Stack, HTST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | 9 | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | 0.250" (6.35mm) | - | - | 0.350" (8.89mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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HTST-105-01-S-DV-A-06-PCONN HEADER SMD 10POS 2.54MM |
0 |
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Flex Stack, HTST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | 9 | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | 0.250" (6.35mm) | - | - | 0.350" (8.89mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide, Keying Slot, Pick and Place | -55°C ~ 125°C | 3.4A per Contact |
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HTST-108-04-H-D-RACONN HEADER R/A 16POS 2.54MM |
0 |
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Flex Stack, HTST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | 0.250" (6.35mm) | 0.130" (3.30mm) | - | 0.365" (9.27mm) | Square | Gold | 30.0µin (0.76µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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HTST-108-04-LM-D-RACONN HEADER R/A 16POS 2.54MM |
0 |
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Flex Stack, HTST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | 0.250" (6.35mm) | 0.130" (3.30mm) | - | 0.365" (9.27mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
