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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Dikdörtgen Bağlantı Cihazları > Bağlantı Noktaları, Erkek Pinleri

Bağlantı Noktaları, Erkek Pinleri

Üretici Parça #	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Bağlantı Cihazı Türü	Kontak Türü	Adım - Eşleşen	Pozisyon Sayısı	Satır Sayısı	Satır Aralığı - Eşleşen	Yüklü Pozisyon Sayısı	Stil	Koruma Örtüsü	Montaj Türü	Sonlandırma	Sabitleme Türü	Kontak Uzunluğu - Eşleşen	Kontak Uzunluğu - Post	Toplam Kontak Uzunluğu	Yalıtım Yüksekliği	Kontak Şekli	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Kontak Bitişi - Post	Kontak Malzemesi	Yalıtım Malzemesi	Özellikler	Çalışma Sıcaklığı	Akım Derecesi (Amper)
SLV W 2 KA 054 58 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	58	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLM N 1 092 17 Z Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 1 092	-	Active	Header	Male Pin	0.050" (1.27mm)	17	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.362" (9.20mm)	0.122" (3.10mm)	0.551" (14.00mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLV W 2 055 20 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 40 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 26 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 036	Tube	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 3 SMD 048 10 Z one row expanded insulator 2-20 Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 3 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	0.118" (3.00mm)	0.374" (9.50mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 048 23 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	23	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 28 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 105 28 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLM N 11 117 12 G Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 11 117	-	Active	Header	Male Pin	0.050" (1.27mm)	12	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.189" (4.80mm)	0.189" (4.80mm)	0.717" (18.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLV W 2 080 64 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	64	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 055 72 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	72	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 105 66 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SL 19 132 58 G Insertion side, dimension "C" ch Fischer Elektronik	-	RFQ	Veri Sayfası	SL 19 132	Bulk	Active	Header	Male Pin	0.100" (2.54mm)	58	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.520" (13.20mm)	0.118" (3.00mm)	-	0.110" (2.80mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	3A
SLV W 2 KA 054 24 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 60 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 055	Tube	Active	Header	Male Pin	0.050" (1.27mm)	60	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 KA 030 40 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLM N 1 092 13 Z Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 1 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	13	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.362" (9.20mm)	0.122" (3.10mm)	0.551" (14.00mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLV W 22 105 70 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	70	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 105 34 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A

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