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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Dikdörtgen Bağlantı Cihazları > Bağlantı Noktaları, Prizi, Dişi Soketleri

Bağlantı Noktaları, Prizi, Dişi Soketleri

Üretici Parça #	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Bağlantı Cihazı Türü	Kontak Türü	Stil	Pozisyon Sayısı	Yüklü Pozisyon Sayısı	Adım - Eşleşen	Satır Sayısı	Satır Aralığı - Eşleşen	Montaj Türü	Sonlandırma	Sabitleme Türü	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Yalıtım Renk	Yalıtım Yüksekliği	Kontak Uzunluğu - Post	Çalışma Sıcaklığı	Malzeme Alevlenebilirlik Derecesi	Kontak Bitişi - Post	Eşleşen Yığınlama Yükseklikleri	Giriş Koruma	Özellikler	Akım Derecesi (Amper)	Voltaj Derecesi
853-43-092-10-011000 CONN RCPT 92POS 0.05 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	853	Bulk	Active	Receptacle	Female Socket	Board to Board	92	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.158" (4.01mm)	0.199" (5.05mm)	-	-	Tin	-	-	-	-	-
833-43-092-10-001000 CONN RCPT 92POS 0.079 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	833	Bulk	Active	Receptacle	Female Socket	Board to Board	92	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.165" (4.20mm)	0.125" (3.18mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
833-93-092-10-001000 CONN RCPT 92POS 0.079 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	833	Bulk	Active	Receptacle	Female Socket	Board to Board	92	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.165" (4.20mm)	0.125" (3.18mm)	-55°C ~ 125°C	UL94 V-0	Tin-Lead	-	-	-	3A	-
803-99-092-61-001000 CONN RCPT 92POS 0.1 TIN-LEAD PCB Mill-Max Manufacturing Corp.	-	RFQ	-	803	Bulk	Active	Receptacle	Female Socket	Board to Board	92	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Press-Fit, Solder	Push-Pull	Tin-Lead	100.0µin (2.54µm)	Black	0.276" (7.00mm)	0.104" (2.64mm)	-55°C ~ 125°C	UL94 V-0	Tin-Lead	-	-	-	4.5A	-
851-43-073-10-002000 CONN RCPT 73POS 0.05 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	851	Bulk	Active	Receptacle	Female Socket	Board to Board	73	All	0.050" (1.27mm)	1	-	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.185" (4.70mm)	0.115" (2.92mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
851-93-073-10-002000 CONN RCPT 73POS 0.05 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	851	Bulk	Active	Receptacle	Female Socket	Board to Board	73	All	0.050" (1.27mm)	1	-	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.185" (4.70mm)	0.115" (2.92mm)	-55°C ~ 125°C	UL94 V-0	Tin-Lead	-	-	-	3A	-
805-43-093-10-012000 CONN RCPT 93POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	805	Bulk	Active	Receptacle	Female Socket	Board to Board	93	All	0.100" (2.54mm)	3	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.165" (4.20mm)	0.125" (3.18mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A	-
SOLC-145-02-L-Q-A-K CONN RCPT 180POS 0.05 GOLD SMD Samtec Inc.	-	RFQ	-	FOURRAY™ SOLC	Tube	Active	Receptacle	Forked	Board to Board	180	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.160" (4.06mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	Board Guide, Pick and Place	2.4A per Contact	-
SOLC-145-02-L-Q-LC-K CONN RCPT 180POS 0.05 GOLD SMD Samtec Inc.	-	RFQ	-	FOURRAY™ SOLC	Tube	Active	Receptacle	Forked	Board to Board	180	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.160" (4.06mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	Board Lock, Pick and Place	2.4A per Contact	-
CLP-134-02-SM-D-K LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	68	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	Pick and Place	3.3A per Contact	240VAC, 330VDC
CLT-138-02-LM-D-BE-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLP-144-02-LTL-D LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	88	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3.3A per Contact	240VAC, 330VDC
CLP-144-02-LM-D-BE LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	88	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3.3A per Contact	240VAC, 330VDC
329-11-142-41-540000 CONN RCPT 42POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	329	Bulk	Active	Receptacle	Female Socket	Board to Board	42	All	0.100" (2.54mm)	1	-	Through Hole	Solder Cup	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.110" (2.79mm)	0.180" (4.57mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	3A	-
ESQT-150-03-G-D-375 CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc.	-	RFQ	Veri Sayfası	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	100	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.375" (9.53mm)	0.083" (2.11mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-03-G-D-310 CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	100	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.310" (7.87mm)	0.148" (3.76mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-03-G-D-312 CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	100	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.312" (7.92mm)	0.146" (3.70mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-03-G-D-320 CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	100	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.320" (8.13mm)	0.138" (3.50mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-03-G-D-358 CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	100	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.358" (9.10mm)	0.100" (2.54mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-03-G-D-360 CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	100	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.360" (9.14mm)	0.098" (2.50mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-

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