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Bağlantı Noktaları, Prizi, Dişi Soketleri
| Fotoğraf | Üretici Parça # | Mevcutluk | Miktar | Veri Sayfası | Seri | Paketlenme | Ürün Durumu | Bağlantı Cihazı Türü | Kontak Türü | Stil | Pozisyon Sayısı | Yüklü Pozisyon Sayısı | Adım - Eşleşen | Satır Sayısı | Satır Aralığı - Eşleşen | Montaj Türü | Sonlandırma | Sabitleme Türü | Kontak Bitişi - Eşleşen | Kontak Bitişi Kalınlığı - Eşleşen | Yalıtım Renk | Yalıtım Yüksekliği | Kontak Uzunluğu - Post | Çalışma Sıcaklığı | Malzeme Alevlenebilirlik Derecesi | Kontak Bitişi - Post | Eşleşen Yığınlama Yükseklikleri | Giriş Koruma | Özellikler | Akım Derecesi (Amper) | Voltaj Derecesi |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CLP-125-02-H-D-PALOW PROFILE DUAL-WIPE SOCKET, .0 |
0 |
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- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 50 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | Gold | - | - | Board Guide, Pick and Place | 3.3A per Contact | 240VAC, 330VDC |
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329-13-156-41-540000CONN RCPT 56POS 0.1 GOLD PCB |
0 |
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Veri Sayfası |
329 | Bulk | Active | Receptacle | Female Socket | Board to Board | 56 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder Cup | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.110" (2.79mm) | 0.180" (4.57mm) | -55°C ~ 125°C | UL94 V-0 | Gold | - | - | - | 3A | - |
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QST-140-02-L-T2.00 MM POWER PLANE SOCKET STRIP |
0 |
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Veri Sayfası |
QST | Tube | Active | Receptacle | Female Socket | Board to Board | 120 | All | 0.079" (2.00mm) | 3 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.500" (12.70mm) | 0.125" (3.18mm) | -55°C ~ 125°C | - | Tin | - | - | - | - | - |
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YTE-130-03-M-Q-3682.00 MM FLEXYZ HIGH-DENSITY ELEV |
0 |
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Veri Sayfası |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | - | -55°C ~ 105°C | - | Tin | - | - | - | - | - |
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YTQ-123-03-L-52.00 MM FLEXYZ HIGH-DENSITY SQUA |
0 |
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Veri Sayfası |
YTQ | Tube | Active | Socket | Forked | Board to Board | 115 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.250" (6.35mm) | 0.208" (5.28mm) | -55°C ~ 125°C | - | Tin | - | - | - | - | - |
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CLE-164-01-F-DV-A-P0.80 MM TIGER BEAM COST-EFFECTIV |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-144-02-LM-D-PLOW PROFILE DUAL WIPE SOCKET, 2. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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YTE-120-02-G-Q-7302.00 MM FLEXYZ HIGH-DENSITY ELEV |
0 |
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Veri Sayfası |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 80 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.730" (18.54mm) | - | -55°C ~ 105°C | - | Tin | - | - | - | - | - |
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CLT-145-02-S-D-BE-PLOW PROFILE DUAL WIPE SOCKET, 2. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-127-02-H-D-BELOW PROFILE DUAL WIPE SOCKET, 2. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-127-02-SM-D-BE-KLOW PROFILE DUAL WIPE SOCKET, 2. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-139-02-LM-D-BE-A-PLOW PROFILE DUAL WIPE SOCKET, 2. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLM-135-02-G-D-PALOW PROFILE DUAL-WIPE SOCKET, 1. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-149-02-S-D-A-KLOW PROFILE DUAL WIPE SOCKET, 2. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLM-134-02-L-D-BE-PLOW PROFILE DUAL-WIPE SOCKET, 1. |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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YTQ-146-01-L-Q2.00 MM FLEXYZ HIGH-DENSITY SQUA |
0 |
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Veri Sayfası |
YTQ | Tube | Active | Socket | Forked | Board to Board | 184 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.250" (6.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | - | Tin | - | - | - | - | - |
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853-13-072-10-003000STANDARD SOCKET HEADER |
0 |
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- |
853 | Bulk | Active | Socket | Female Socket | Board to Board | 72 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Through Hole | Solder Cup | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.149" (3.78mm) | 0.191" (4.85mm) | -55°C ~ 125°C | UL94 V-0 | Gold | - | - | - | 3A | - |
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YTE-115-03-G-Q-3402.00 MM FLEXYZ HIGH-DENSITY ELEV |
0 |
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Veri Sayfası |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 60 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.340" (8.64mm) | - | -55°C ~ 105°C | - | Tin | - | - | - | - | - |
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329-11-161-41-540000CONN RCPT 61POS 0.1 GOLD PCB |
0 |
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Veri Sayfası |
329 | Bulk | Active | Receptacle | Female Socket | Board to Board | 61 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder Cup | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.110" (2.79mm) | 0.180" (4.57mm) | -55°C ~ 125°C | UL94 V-0 | Gold | - | - | - | 3A | - |
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SQT-137-01-H-TCONN RCPT 111POS 0.079 GOLD PCB |
0 |
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- |
SQT | Tube | Active | Receptacle | Forked | Board to Board or Cable | 111 | All | 0.079" (2.00mm) | 3 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 50.0µin (1.27µm) | Black | 0.250" (6.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | Gold | - | - | - | 5.1A per Contact | - |
