7/24 Kullanılabilir
+86 13632816717
ED Soketleri
| Fotoğraf | Üretici Parça # | Mevcutluk | Miktar | Veri Sayfası | Seri | Paketlenme | Ürün Durumu | Tür | Pozisyon veya Pin Sayısı (Izgara) | Adım - Eşleşen | Kontak Bitişi - Eşleşen | Kontak Bitişi Kalınlığı - Eşleşen | Kontak Malzemesi - Eşleşen | Montaj Türü | Özellikler | Sonlandırma | Adım - Post | Kontak Bitişi - Post | Kontak Bitişi Kalınlığı - Post | Kontak Malzemesi - Post | Koruyucu Malzemesi | Çalışma Sıcaklığı |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-83-650-41-018101CONN IC DIP SOCKET 50POS GOLD |
0 |
|
Veri Sayfası |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
30-6513-11CONN IC DIP SOCKET 30POS GOLD |
0 |
|
Veri Sayfası |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
24-6518-111CONN IC DIP SOCKET 24POS GOLD |
0 |
|
Veri Sayfası |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
ICF-640-T-I.100" SURFACE MOUNT SCREW MACHIN |
0 |
|
Veri Sayfası |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
|
|
614-87-044-08-031112CONN SOCKET PGA 44POS GOLD |
0 |
|
Veri Sayfası |
614 | Bulk | Active | PGA | 44 (8 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0207-G-22.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
Veri Sayfası |
HLS | Tube | Active | SIP | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
614-93-328-31-012000CONN IC DIP SOCKET 28POS GOLD |
0 |
|
Veri Sayfası |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
]-1xx-41-013000.jpg)
|
346-93-120-41-013000CONN SOCKET SIP 20POS GOLD |
0 |
|
Veri Sayfası |
346 | Tube | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
346-43-120-41-013000CONN SOCKET SIP 20POS GOLD |
0 |
|
Veri Sayfası |
346 | Tube | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
116-83-648-41-003101CONN IC DIP SOCKET 48POS GOLD |
0 |
|
Veri Sayfası |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
06-8950-310CCONN IC DIP SOCKET 6POS GOLD |
0 |
|
Veri Sayfası |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
XR2A-2801-NCONN IC DIP SOCKET 28POS GOLD |
0 |
|
Veri Sayfası |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
|
510-83-096-11-041101CONN SOCKET PGA 96POS GOLD |
0 |
|
Veri Sayfası |
510 | Bulk | Active | PGA | 96 (11 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
18-0511-10CONN SOCKET SIP 18POS TIN |
0 |
|
Veri Sayfası |
511 | Bulk | Active | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
14-6823-90TCONN IC DIP SOCKET 14POS TIN |
0 |
|
Veri Sayfası |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
510-87-175-16-001101CONN SOCKET PGA 175POS GOLD |
0 |
|
Veri Sayfası |
510 | Bulk | Active | PGA | 175 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-175-16-071101CONN SOCKET PGA 175POS GOLD |
0 |
|
Veri Sayfası |
510 | Bulk | Active | PGA | 175 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-175-16-072101CONN SOCKET PGA 175POS GOLD |
0 |
|
Veri Sayfası |
510 | Bulk | Active | PGA | 175 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
8058-1G24CONN TRANSIST TO-5 4POS GOLD |
0 |
|
Veri Sayfası |
8058 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | - | Solder Cup | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
24-6518-101CONN IC DIP SOCKET 24POS GOLD |
0 |
|
Veri Sayfası |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
