Lütfen en güncel fiyat ve miktar bilgisi için bizimle iletişime geçin.

ED Soketleri

Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
ICO-422-LGG

ICO-422-LGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-422-LGG

Veri Sayfası

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-320-ZAGT

ICO-320-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-320-ZAGT

Veri Sayfası

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
PGA132H004B1-1414R

PGA132H004B1-1414R

PGA SOCKET 132 CTS

Amphenol ICC (FCI)

0
RFQ
PGA132H004B1-1414R

Veri Sayfası

- - Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
12-81250-610C

12-81250-610C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0
RFQ
12-81250-610C

Veri Sayfası

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8260-610C

12-8260-610C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0
RFQ
12-8260-610C

Veri Sayfası

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8300-610C

12-8300-610C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0
RFQ
12-8300-610C

Veri Sayfası

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
XR2T-2421-N

XR2T-2421-N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

0
RFQ
XR2T-2421-N

Veri Sayfası

XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
510-87-209-17-001101

510-87-209-17-001101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

0
RFQ
510-87-209-17-001101

Veri Sayfası

510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-209-17-062101

510-87-209-17-062101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

0
RFQ
510-87-209-17-062101

Veri Sayfası

510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-209-17-063101

510-87-209-17-063101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

0
RFQ
510-87-209-17-063101

Veri Sayfası

510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-237-17-061101

510-87-237-17-061101

CONN SOCKET PGA 237POS GOLD

Preci-Dip

0
RFQ
510-87-237-17-061101

Veri Sayfası

510 Bulk Active PGA 237 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0207-G-32

HLS-0207-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0207-G-32

Veri Sayfası

HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0407-S-2

HLS-0407-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0407-S-2

Veri Sayfası

HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
614-41-304-41-001000

614-41-304-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-41-304-41-001000

Veri Sayfası

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-304-41-001000

614-91-304-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-91-304-41-001000

Veri Sayfası

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0117-G-10

HLS-0117-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0117-G-10

Veri Sayfası

HLS Tube Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
13-0503-20

13-0503-20

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0
RFQ
13-0503-20

Veri Sayfası

0503 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
HLS-0306-T-12

HLS-0306-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0306-T-12

Veri Sayfası

HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-210-17-061101

510-87-210-17-061101

CONN SOCKET PGA 210POS GOLD

Preci-Dip

0
RFQ
510-87-210-17-061101

Veri Sayfası

510 Bulk Active PGA 210 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-516-10

28-516-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

0
RFQ
28-516-10

Veri Sayfası

516 Bulk Obsolete DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
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