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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Entegre Devreler (ED'ler), Transistörler için Soketleri > ED Soketleri

ED Soketleri

Üretici Parça #	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Tür	Pozisyon veya Pin Sayısı (Izgara)	Adım - Eşleşen	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Kontak Malzemesi - Eşleşen	Montaj Türü	Özellikler	Sonlandırma	Adım - Post	Kontak Bitişi - Post	Kontak Bitişi Kalınlığı - Post	Kontak Malzemesi - Post	Koruyucu Malzemesi	Çalışma Sıcaklığı
20-7810-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7820-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7825-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7850-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7875-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7903-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7905-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7906-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
317-91-102-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	317	Bulk	Active	SIP	2 (1 x 2)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
114-41-306-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	114	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
114-91-306-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	114	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
17-71140-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
17-71250-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
17-7465-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
17-7490-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
17-7500-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
17-7650-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
17-7750-10 CONN SOCKET SIP 17POS TIN Aries Electronics	-	RFQ	Veri Sayfası	700 Elevator Strip-Line™	Bulk	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-810-90WR CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	Veri Sayfası	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
115-43-304-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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