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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Entegre Devreler (ED'ler), Transistörler için Soketleri > ED Soketleri

ED Soketleri

Üretici Parça #	Mevcutluk	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Tür	Pozisyon veya Pin Sayısı (Izgara)	Adım - Eşleşen	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Kontak Malzemesi - Eşleşen	Montaj Türü	Özellikler	Sonlandırma	Adım - Post	Kontak Bitişi - Post	Kontak Bitişi Kalınlığı - Post	Kontak Malzemesi - Post	Koruyucu Malzemesi	Çalışma Sıcaklığı
110-43-314-41-801000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	80	-	RFQ	Veri Sayfası	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-308-10-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	38	-	RFQ	Veri Sayfası	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
111-93-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	76	-	RFQ	Veri Sayfası	111	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-316-41-801000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	79	-	RFQ	Veri Sayfası	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-13-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	52	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
117-93-430-41-005000 CONN IC DIP SOCKET 30POS GOLD Mill-Max Manufacturing Corp.	53	-	RFQ	Veri Sayfası	117	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	30 (2 x 15)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-320-41-801000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	98	-	RFQ	Veri Sayfası	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-93-314-11-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	74	-	RFQ	Veri Sayfası	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	52	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	43	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICO-628-NGT CONN IC DIP SOCKET 28POS GOLD Samtec Inc.	41	-	RFQ	Veri Sayfası	ICO	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
110-13-314-41-801000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	67	-	RFQ	Veri Sayfası	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
48-6518-10 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	73	-	RFQ	Veri Sayfası	518	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
123-13-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	41	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
08-823-90 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	58	-	RFQ	Veri Sayfası	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
XR2P2041 CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div	96	-	RFQ	Veri Sayfası	XR2	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
123-93-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	79	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-93-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	34	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
117-93-642-41-005000 CONN IC DIP SOCKET 42POS GOLD Mill-Max Manufacturing Corp.	70	-	RFQ	Veri Sayfası	117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-13-320-41-801000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	92	-	RFQ	Veri Sayfası	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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