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Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
116-91-632-41-006000

116-91-632-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-91-632-41-006000

Veri Sayfası

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-226-31-018000

714-43-226-31-018000

CONN IC DIP SOCKET 26POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-226-31-018000

Veri Sayfası

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-322-31-012000

614-41-322-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-41-322-31-012000

Veri Sayfası

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-422-31-012000

614-41-422-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-41-422-31-012000

Veri Sayfası

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-322-31-012000

614-91-322-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-91-322-31-012000

Veri Sayfası

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-422-31-012000

614-91-422-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
RFQ
614-91-422-31-012000

Veri Sayfası

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-0511-11

16-0511-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0
RFQ
16-0511-11

Veri Sayfası

511 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-41-320-41-001000

116-41-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-41-320-41-001000

Veri Sayfası

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-420-41-001000

116-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-41-420-41-001000

Veri Sayfası

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-320-41-001000

116-91-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-91-320-41-001000

Veri Sayfası

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-420-41-001000

116-91-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-91-420-41-001000

Veri Sayfası

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0424-T-T

APH-0424-T-T

APH-0424-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1924-T-T

APH-1924-T-T

APH-1924-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0924-T-T

APH-0924-T-T

APH-0924-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1524-T-T

APH-1524-T-T

APH-1524-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0224-T-T

APH-0224-T-T

APH-0224-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0324-T-T

APH-0324-T-T

APH-0324-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-93-324-41-003000

116-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
116-93-324-41-003000

Veri Sayfası

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-424-41-003000

116-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
116-93-424-41-003000

Veri Sayfası

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-624-41-003000

116-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
116-93-624-41-003000

Veri Sayfası

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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