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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Entegre Devreler (ED'ler), Transistörler için Soketleri > ED Soketleri

ED Soketleri

Üretici Parça #	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Tür	Pozisyon veya Pin Sayısı (Izgara)	Adım - Eşleşen	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Kontak Malzemesi - Eşleşen	Montaj Türü	Özellikler	Sonlandırma	Adım - Post	Kontak Bitişi - Post	Kontak Bitişi Kalınlığı - Post	Kontak Malzemesi - Post	Koruyucu Malzemesi	Çalışma Sıcaklığı
123-91-432-41-001000 SOCKET IC OPEN 3 LVL .400 32POS Mill-Max Manufacturing Corp.	-	RFQ	-	123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-91-632-41-001000 SOCKET IC OPEN 3 LVL .600 32POS Mill-Max Manufacturing Corp.	-	RFQ	-	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-41-432-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-41-632-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
18-822-90T CONN IC DIP SOCKET 18POS TIN Aries Electronics	-	RFQ	Veri Sayfası	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
18-823-90T CONN IC DIP SOCKET 18POS TIN Aries Electronics	-	RFQ	Veri Sayfası	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
123-11-318-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-87-133-14-071112 CONN SOCKET PGA 133POS GOLD Preci-Dip	-	RFQ	Veri Sayfası	614	Bulk	Active	PGA	133 (14 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
60-9513-10H CONN IC DIP SOCKET 60POS GOLD Aries Electronics	-	RFQ	Veri Sayfası	Lo-PRO®file, 513	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	60 (2 x 30)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
117-41-428-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	117	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.070" (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-93-636-41-006000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-636-41-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
714-43-154-31-018000 CONN SOCKET SIP 54POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Veri Sayfası	714	Bulk	Active	SIP	54 (1 x 54)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APH-0428-T-T APH-0428-T-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0426-T-R APH-0426-T-R Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1828-T-T APH-1828-T-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1428-T-T APH-1428-T-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0528-T-T APH-0528-T-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1028-T-T APH-1028-T-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0628-T-T APH-0628-T-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

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