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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Dikdörtgen Bağlantı Cihazları > Bağlantı Noktaları, Erkek Pinleri

Bağlantı Noktaları, Erkek Pinleri

Üretici Parça #	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Bağlantı Cihazı Türü	Kontak Türü	Adım - Eşleşen	Pozisyon Sayısı	Satır Sayısı	Satır Aralığı - Eşleşen	Yüklü Pozisyon Sayısı	Stil	Koruma Örtüsü	Montaj Türü	Sonlandırma	Sabitleme Türü	Kontak Uzunluğu - Eşleşen	Kontak Uzunluğu - Post	Toplam Kontak Uzunluğu	Yalıtım Yüksekliği	Kontak Şekli	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Kontak Bitişi - Post	Kontak Malzemesi	Yalıtım Malzemesi	Özellikler	Çalışma Sıcaklığı	Akım Derecesi (Amper)
SLM N 1 063 12 G Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 1 063	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	12	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.248" (6.30mm)	0.122" (3.10mm)	0.437" (11.10mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLM N 1 092 15 Z Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 1 092	-	Active	Header	Male Pin	0.050" (1.27mm)	15	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.362" (9.20mm)	0.122" (3.10mm)	0.551" (14.00mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLM N 1 063 13 G Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 1 063	-	Active	Header	Male Pin	0.050" (1.27mm)	13	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.248" (6.30mm)	0.122" (3.10mm)	0.437" (11.10mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLV W 2 036 30 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	30	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLM N 1 117 17 Z Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 1 117	-	Active	Header	Male Pin	0.050" (1.27mm)	17	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.461" (11.70mm)	0.122" (3.10mm)	0.650" (16.50mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLM N 11 117 7 G Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 11 117	-	Active	Header	Male Pin	0.050" (1.27mm)	7	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.189" (4.80mm)	0.189" (4.80mm)	0.717" (18.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLV W 2 KA 054 38 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 055 44 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 048 60 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	60	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 080 68 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	68	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 6 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 055 64 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	64	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 KA 030 48 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLM N 11 063 15 G Straight, narrow insulator Fischer Elektronik	-	RFQ	Veri Sayfası	SLM N 11 063	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	15	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.248" (6.30mm)	0.189" (4.80mm)	0.504" (12.80mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	-40°C ~ 163°C	1.5A
SLV W 2 080 50 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	50	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 048 24 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 048	Tube	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 130 50 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	50	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 KA 030 4 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	4	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 60 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	60	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 080 20 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A

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