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Ana Sayfa > Ürünler > Bağlantı Cihazları, İnterkonektler > Dikdörtgen Bağlantı Cihazları > Bağlantı Noktaları, Erkek Pinleri

Bağlantı Noktaları, Erkek Pinleri

Üretici Parça #	Fiyat	Miktar	Veri Sayfası	Seri	Paketlenme	Ürün Durumu	Bağlantı Cihazı Türü	Kontak Türü	Adım - Eşleşen	Pozisyon Sayısı	Satır Sayısı	Satır Aralığı - Eşleşen	Yüklü Pozisyon Sayısı	Stil	Koruma Örtüsü	Montaj Türü	Sonlandırma	Sabitleme Türü	Kontak Uzunluğu - Eşleşen	Kontak Uzunluğu - Post	Toplam Kontak Uzunluğu	Yalıtım Yüksekliği	Kontak Şekli	Kontak Bitişi - Eşleşen	Kontak Bitişi Kalınlığı - Eşleşen	Kontak Bitişi - Post	Kontak Malzemesi	Yalıtım Malzemesi	Özellikler	Çalışma Sıcaklığı	Akım Derecesi (Amper)
SLV W 2 130 20 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 073 22 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	22	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 055 24 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 18 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 62 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 055 52 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	52	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 105 20 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 048 58 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	58	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 72 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	72	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 28 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 KA 054 8 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 KA 054	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	8	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.213" (5.40mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 62 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 56 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 7 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	7	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 073 66 Z pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 19 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	19	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 66 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 048 64 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	64	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 60 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	60	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 SMD 073 40 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	Veri Sayfası	SLV W 2 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A

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