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ED Soketleri

Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
05-0518-11H

05-0518-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0
RFQ
05-0518-11H

Veri Sayfası

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0518-10

13-0518-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0
RFQ
13-0518-10

Veri Sayfası

518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0508-30

03-0508-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0
RFQ
03-0508-30

Veri Sayfası

508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
SIP1X27-014B

SIP1X27-014B

SIP1X27-014B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

0
RFQ
SIP1X27-014B

Veri Sayfası

SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-87-610-41-007101

116-87-610-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
116-87-610-41-007101

Veri Sayfası

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-312-41-105101

110-83-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0
RFQ
110-83-312-41-105101

Veri Sayfası

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-324-41-605101

110-87-324-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
110-87-324-41-605101

Veri Sayfası

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-324-41-005101

110-87-324-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
110-87-324-41-005101

Veri Sayfası

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0102-G-12

HLS-0102-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0102-G-12

Veri Sayfası

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ARO 64-HZL/NEC-T

ARO 64-HZL/NEC-T

SOCKET

Assmann WSW Components

0
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
540-99-032-24-000000

540-99-032-24-000000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
540-99-032-24-000000

Veri Sayfası

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
AR24-HZL/7/07-TT

AR24-HZL/7/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0
RFQ

-

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
ED044PLCZ

ED044PLCZ

CONN SOCKET PLCC 44POS TIN

On Shore Technology Inc.

0
RFQ
ED044PLCZ

Veri Sayfası

ED Tube Active PLCC 44 (2 x 22) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
A-ICS-254-08-TT50

A-ICS-254-08-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0
RFQ
A-ICS-254-08-TT50

Veri Sayfası

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
D2614-42

D2614-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

0
RFQ
D2614-42

Veri Sayfası

D26 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 32 HGL-TT

AR 32 HGL-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-83-308-41-009101

116-83-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0
RFQ
116-83-308-41-009101

Veri Sayfası

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-2513-10T

10-2513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-2513-10T

Veri Sayfası

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0518-11

09-0518-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0
RFQ
09-0518-11

Veri Sayfası

518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0518-10H

11-0518-10H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0
RFQ
11-0518-10H

Veri Sayfası

518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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