Lütfen en güncel fiyat ve miktar bilgisi için bizimle iletişime geçin.

ED Soketleri

Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
214-44-624-01-670800

214-44-624-01-670800

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

0
RFQ
214-44-624-01-670800

Veri Sayfası

214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-87-420-41-035101

146-87-420-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
146-87-420-41-035101

Veri Sayfası

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-420-41-036101

146-87-420-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
146-87-420-41-036101

Veri Sayfası

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-314-ZSTT

ICO-314-ZSTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-314-ZSTT

Veri Sayfası

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
110-83-324-41-105101

110-83-324-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
110-83-324-41-105101

Veri Sayfası

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SA649040

SA649040

CONN IC DIP SOCKET 64POS GOLD

On Shore Technology Inc.

0
RFQ
SA649040

Veri Sayfası

SA Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
2-1571551-8

2-1571551-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0
RFQ
2-1571551-8

Veri Sayfası

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-87-068-09-001101

510-87-068-09-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0
RFQ
510-87-068-09-001101

Veri Sayfası

510 Bulk Active PGA 68 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-322-41-018101

116-83-322-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
116-83-322-41-018101

Veri Sayfası

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-632-41-001101

612-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0
RFQ
612-87-632-41-001101

Veri Sayfası

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0104-G-12

HLS-0104-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0104-G-12

Veri Sayfası

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICF-308-TL-I

ICF-308-TL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-308-TL-I

Veri Sayfası

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-87-628-41-003101

116-87-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
116-87-628-41-003101

Veri Sayfası

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-624-41-105101

110-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
110-83-624-41-105101

Veri Sayfası

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-2513-11H

06-2513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0
RFQ
06-2513-11H

Veri Sayfası

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-0513-10H

14-0513-10H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0
RFQ
14-0513-10H

Veri Sayfası

0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0518-11H

11-0518-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0
RFQ
11-0518-11H

Veri Sayfası

518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0518-11

19-0518-11

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0
RFQ
19-0518-11

Veri Sayfası

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0106-T-31

HLS-0106-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0106-T-31

Veri Sayfası

HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
28-3518-10T

28-3518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-3518-10T

Veri Sayfası

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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