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ED Soketleri

Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
16-0513-11

16-0513-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0
RFQ
16-0513-11

Veri Sayfası

0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-0503-20

06-0503-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0
RFQ
06-0503-20

Veri Sayfası

0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
06-0503-30

06-0503-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0
RFQ
06-0503-30

Veri Sayfası

0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
18-3518-00

18-3518-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0
RFQ
18-3518-00

Veri Sayfası

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
15-0518-00

15-0518-00

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0
RFQ
15-0518-00

Veri Sayfası

518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-1814640-5

2-1814640-5

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0
RFQ
2-1814640-5

Veri Sayfası

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
212-1-18-003

212-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

0
RFQ
212-1-18-003

Veri Sayfası

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
SIP050-1X32-160B

SIP050-1X32-160B

1X32-160B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X32-160B

Veri Sayfası

SIP050-1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-83-420-41-012101

116-83-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
116-83-420-41-012101

Veri Sayfası

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-318-41-008101

116-83-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
116-83-318-41-008101

Veri Sayfası

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-318-41-035101

146-83-318-41-035101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
146-83-318-41-035101

Veri Sayfası

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-318-41-036101

146-83-318-41-036101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
146-83-318-41-036101

Veri Sayfası

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-43-107-41-013000

346-43-107-41-013000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
346-43-107-41-013000

Veri Sayfası

346 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-308-T-M

APA-308-T-M

ADAPTER PLUG

Samtec Inc.

0
RFQ
APA-308-T-M

Veri Sayfası

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
510-87-064-10-051101

510-87-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0
RFQ
510-87-064-10-051101

Veri Sayfası

510 Bulk Active PGA 64 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-424-41-006101

116-83-424-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-83-424-41-006101

Veri Sayfası

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
824-AG11D-ES

824-AG11D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0
RFQ
824-AG11D-ES

Veri Sayfası

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
540-44-052-17-400000

540-44-052-17-400000

CONN SOCKET PLCC 52POS TIN

Mill-Max Manufacturing Corp.

0
RFQ
540-44-052-17-400000

Veri Sayfası

540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
122-83-420-41-001101

122-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
122-83-420-41-001101

Veri Sayfası

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-420-41-001101

123-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
123-83-420-41-001101

Veri Sayfası

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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