Lütfen en güncel fiyat ve miktar bilgisi için bizimle iletişime geçin.

ED Soketleri

Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
10-8535-210C

10-8535-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-8535-210C

Veri Sayfası

8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-8810-210C

10-8810-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-8810-210C

Veri Sayfası

8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-8500-611C

14-8500-611C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-8500-611C

Veri Sayfası

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
1108883-05

1108883-05

SERIES 0517 PIN-LINE VERTISOCKET

Aries Electronics

0
RFQ
1108883-05

Veri Sayfası

- - Active - - - - - - - - - - - - - - -
1109800-14

1109800-14

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
1109800-14

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-16

1109800-16

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0
RFQ
1109800-16

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-20

1109800-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
1109800-20

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-28

1109800-28

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
1109800-28

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-10

1109800-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
1109800-10

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-12

1109800-12

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0
RFQ
1109800-12

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-22

1109800-22

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0
RFQ
1109800-22

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-24

1109800-24

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0
RFQ
1109800-24

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-26

1109800-26

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0
RFQ
1109800-26

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109800-8

1109800-8

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
1109800-8

Veri Sayfası

Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109681-308

1109681-308

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
1109681-308

Veri Sayfası

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109681-316

1109681-316

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0
RFQ
1109681-316

Veri Sayfası

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109681-632

1109681-632

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
1109681-632

Veri Sayfası

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1109681-648

1109681-648

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0
RFQ
1109681-648

Veri Sayfası

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
54020-68030LF

54020-68030LF

CONN SOCKET PLCC 68POS TIN

Amphenol ICC (FCI)

0
RFQ
54020-68030LF

Veri Sayfası

- Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
54020-52030LF

54020-52030LF

CONN SOCKET PLCC 52POS TIN

Amphenol ICC (FCI)

0
RFQ
54020-52030LF

Veri Sayfası

- Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
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