Lütfen en güncel fiyat ve miktar bilgisi için bizimle iletişime geçin.

ED Soketleri

Fotoğraf Üretici Parça # Mevcutluk Fiyat Miktar Veri Sayfası Seri Paketlenme Ürün Durumu Tür Pozisyon veya Pin Sayısı (Izgara) Adım - Eşleşen Kontak Bitişi - Eşleşen Kontak Bitişi Kalınlığı - Eşleşen Kontak Malzemesi - Eşleşen Montaj Türü Özellikler Sonlandırma Adım - Post Kontak Bitişi - Post Kontak Bitişi Kalınlığı - Post Kontak Malzemesi - Post Koruyucu Malzemesi Çalışma Sıcaklığı
8080-1G2

8080-1G2

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0
RFQ
8080-1G2

Veri Sayfası

- Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Through Hole Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
8080-1G3

8080-1G3

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0
RFQ
8080-1G3

Veri Sayfası

- Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Phenolic -55°C ~ 125°C
8080-1G35

8080-1G35

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0
RFQ
8080-1G35

Veri Sayfası

- Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
8080-1G36

8080-1G36

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0
RFQ
8080-1G36

Veri Sayfası

- Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver 500.0µin (12.70µm) Beryllium Copper Phenolic -55°C ~ 125°C
8080-1G37

8080-1G37

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0
RFQ
8080-1G37

Veri Sayfası

- Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver 500.0µin (12.70µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
8-1437504-6

8-1437504-6

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0
RFQ
8-1437504-6

Veri Sayfası

8080 Bulk Active Transistor, TO-3 3 (Oval) - Gold 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
824-AG66D

824-AG66D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0
RFQ
824-AG66D

Veri Sayfası

800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
9-1437537-3

9-1437537-3

CONN IC DIP SOCKET 3POS GOLD

TE Connectivity AMP Connectors

0
RFQ
9-1437537-3

Veri Sayfası

800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
9-1437539-6

9-1437539-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0
RFQ
9-1437539-6

Veri Sayfası

800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
2040636-5

2040636-5

CONN SOCKET LGA 1567POS GOLD

TE Connectivity AMP Connectors

0
RFQ
2040636-5

Veri Sayfası

- Tray Active LGA 1567 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
1977291-1

1977291-1

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0
RFQ
1977291-1

Veri Sayfası

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -
8-1437529-1

8-1437529-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0
RFQ
8-1437529-1

Veri Sayfası

500 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 47.2µin (1.20µm) Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
1825088-2

1825088-2

CONN IC DIP SOCKET 12POS GOLD

TE Connectivity AMP Connectors

0
RFQ
1825088-2

Veri Sayfası

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Press-Fit 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -
8-1437531-4

8-1437531-4

520-AG11F=SOCKET ASSY

TE Connectivity AMP Connectors

0
RFQ
8-1437531-4

Veri Sayfası

500 Bulk Active - - - - - - - - - - - - - - -
1747890-1

1747890-1

DSL ASSY LGA771 LEADED

TE Connectivity AMP Connectors

0
RFQ
1747890-1

Veri Sayfası

- Tray Active LGA 771 (33 x 33) 0.043" (1.09mm) - - Copper Alloy Surface Mount - Solder 0.043" (1.09mm) Tin - - Thermoplastic -25°C ~ 100°C
1-1981837-2

1-1981837-2

CONN SOCKET LGA 1366POS GOLD

TE Connectivity AMP Connectors

0
RFQ
1-1981837-2

Veri Sayfası

- Tray Active LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
1825532-4

1825532-4

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

0
RFQ
1825532-4

Veri Sayfası

- - Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin Flash Beryllium Copper Polyester -
4-2013620-3

4-2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

0
RFQ
4-2013620-3

Veri Sayfası

- Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
1-2013620-1

1-2013620-1

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

0
RFQ
1-2013620-1

Veri Sayfası

- Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
9-6437529-4

9-6437529-4

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0
RFQ
9-6437529-4

Veri Sayfası

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Thermoplastic, Polyester -
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